+49 3327 57 062 0
Robot soldering systems


The PLA is a modern, electromagnetic induction pump adapted to lead-free soldering technology. It is unrivalled with respect to soldering time in the application field of wired construction elements. Combined with the advantages of the nozzle quick-change system, the very low maintenance and operating costs incurred represent the latest technology.

Adapted nozzle shapes are available for production of your products.

Regardless of the product, with a solder bath you have 3 different soldering processes in a few steps and at low cost.

Technical specifications

PLA drive: electromagnetically inductive
Solder volume: max. 25 kg depending on alloy
Solder level indication: resistive monitoring
Heating-up time: 45 min. = 500°C / ± 2°C
Solder use: all electrolytes lead-free
Control unit: Siemens Simatic S7
Parameter input: LCD display / PC
Interface: Serial RS 232
Interface: Profibus DP
Interface: Ethernet
Solder wire intake: Ø 1 – 4 mm / 15 kg / 24V DC
Solder rod: max. Ø 18 mm
Inert gas N2 5.0: min. 200 l/h
Gas pressure: max. 5 bar
Inert gas monitoring: Flow measurement
Standard dimensions: 1500 x 1500 x 1900 mm
Operating voltage: 400 V
Connected power: 4 kW
Compressed air: 5 bar


  • Inductive solder drive
  • Lead-free soldering unit
  • Compact design
  • Process monitoring


  • One standard soldering device for 3 solder variants
  • PIN-oriented soldering
  • Thermal energy at joint location immediately and with no loss
  • Low soldering times depending on paint qualities (30 – 1500 ms)
  • Tex-E wire soldering with no pre-treatment
  • Process monitoring:
    • Tin spray
    • Solder height
    • Overflow control
    • Inert gas N2 5.0
    • Temperature behaviour
  • Short changeover times
  • Low maintenance costs
  • Easy accessibility
  • Quick change of solder variants

We offer

  • Maximum flexibility
  • Modularity
  • All levels of freedom with 6-axle robots
  • The solution for small to large quantities
  • Inline or standalone
  • Easy operator guidance with graphical interface
  • Process monitoring and data acquisition

Download the product brochure in PDF.

product brochure (1.6 MiB)